台鑫銅箔 TAIHSIN
COPPER FOIL
TAIHSIN
COPPER
台鑫銅箔 TAIHSIN
COPPER FOIL
TAIHSIN
COPPER
TAI HSIN COPPER FOIL is the only specialized manufacturer in Taiwan with expertise in rolled copper foil surface treatment technology. We are dedicated to delivering high-quality electronic-grade copper foil materials with flexible lead times, widely used in advanced industries such as lithium batteries, electric vehicles, 5G communications, and AI.
With over two decades of solid technical and manufacturing experience, TAI HSIN consistently insists on using high-purity raw materials imported from Japan to ensure that every batch meets international quality standards. We emphasize not only innovation and R&D, but also prioritize reliable delivery and flexibility to meet customer demands, continuously expanding our presence in the global market.
Founded in 1999, we have over two decades of dedicated expertise in copper foil surface treatment for the electronic materials industry.
The only manufacturer in Taiwan specializing in rolled copper foil surface treatment.
Focused on the development of surface treatment formulas and process optimization.
Utilizes raw materials imported from Japan to ensure stable and reliable quality.
Flexible lead times and prompt responses have earned strong customer trust.
Certified under ISO international quality and environmental management systems.
SGS-tested and compliant with international environmental regulations.
Committed to sustainable development and the promotion of eco-friendly materials.
TAI HSIN not only possesses industry-leading capabilities in rolled copper foil manufacturing but also has extensive experience in surface treatment processing. We develop a wide range of functional surface treatment solutions tailored for high-end electronic applications. Our focus is on achieving high consistency, low loss, strong adhesion, and environmentally friendly processes. Whether using our own copper foil or customer-supplied substrates, we provide the most professional and reliable surface treatment services.
Finer Nodulation
In response to the trend of thinner electronic products and higher circuit board density, our fine nodulation surface treatment and ultra-small copper nodule size facilitate the fabrication of precise etched circuits for downstream applications.
Ultimate Low Profile and High Adhesion
With ultra-low surface roughness and reduced impedance, signal loss is minimized, allowing faster signal transmission—ideal for high-end, high-frequency applications. Our specialized surface treatment maintains high peel strength even under ultra-low roughness conditions.
Great Thermal Resistance
Excellent resistance to high temperatures and superior ductility help preserve circuit integrity and improve production yield.
Environment Friendly Issues
All products are SGS-tested and comply with RoHS, REACH, arsenic-free, halogen-free, and other international environmental standards.
No.14, Datong 2nd Rd., Guanyin Dist., Taoyuan City 328, Taiwan.